Formal Verification
Analyze functional correctness. Find corner cases. Accelerate verification closure.
- Property Checking
- Assertion-Based Verification
- Formal Debug
- Counterexample Analysis
- Equivalence
- Convergence Support
SEMICONDUCTOR ENGINEERING SERVICES
Built for signoff.
Engineered for
silicon.
We deliver ASIC/SoC engineering services with deep expertise in Formal Verification, STA & Timing Closure, and EM/IR & Power Integrity — backed by complete Physical Design and RTL-to-GDSII capabilities. Every design that leaves our hands is signoff-ready before it reaches yours.
FORMALVERIFICATION
STA &TIMING CLOSURE
EM/IR &POWER INTEGRITY
PHYSICAL DESIGN& SIGNOFF
ASIC implementation flow
RTL
Synthesis
Floorplan
Placement
CTS
Routing
STA
EMIR
Physical
Verification
Verification
Signoff
Formal Verification runs as a parallel functional signoff track across the implementation flow.
CORE FOCUS
Signoff Is Our Core
Terasilicon IQ focuses on engineering activities that become critical as ASIC/SoC designs move towards closure and signoff.
STA & Timing Closure
Analyze. Debug. Optimize. Close.
- SDC
- MCMM
- Setup / Hold
- Timing Analysis
- Critical Paths
- Timing Closure
EMIR & Power Integrity
Analyze power integrity and support EM/IR closure.
- Static IR
- Dynamic IR
- Electromigration
- Power Integrity
- Violation Analysis
- Closure Support
Physical Design & Signoff
Drive implementation towards signoff.
- Floorplanning
- Placement
- CTS
- Routing
- Optimization
- Physical Closure
CAPABILITIES
Our Engineering Capabilities
Engineering support across the RTL-to-GDSII lifecycle.
Formal Verification
Property Checking, Equivalence, Formal Debug, Convergence Support
→
STA & Timing Closure
SDC, MCMM, Setup/Hold, Critical Path Analysis, Timing Closure
→
EMIR & Power Integrity
Static/Dynamic IR, Electromigration, Violation Analysis, Closure Support
→
Physical Design & Signoff
Floorplanning, Placement, CTS, Routing, Optimization, Physical Closure
→
RTL, Design Verification & DFT
RTL development, SystemVerilog, UVM, coverage, scan, ATPG and MBIST
→
Physical Verification
DRC, LVS support, layout debugging and physical closure
→
HOW WE WORK
How We Work With Semiconductor Teams
Focused Signoff Support
For a specific Formal, STA, EMIR or Physical Design requirement.
Project-Based Engineering
A defined technical scope with milestones and deliverables.
Dedicated Engineering Team
Engineering capacity built around your project requirements.
Engineering Extension
Long-term collaboration where Terasilicon IQ operates as an extension of your internal engineering organization.
BEYOND SIGNOFF
Broader ASIC/SoC Engineering Services
While signoff is our primary engineering focus, we provide broader ASIC/SoC capabilities based on customer requirements.
RTL Design
RTL development, optimization and implementation readiness.
Design Verification
SystemVerilog, UVM, functional verification, coverage and debug.
DFT
Scan, ATPG, MBIST, DFT verification and test coverage.
ASIC/SoC Implementation
Support across the RTL-to-GDSII lifecycle.
GLOBAL ENGINEERING DELIVERY
Engineering Support for Global Teams
Terasilicon IQ provides India-based semiconductor engineering support for global technology and semiconductor teams.
- India-based engineering team
- Remote collaboration
- Flexible engagement
- Dedicated engineering teams
- Scalable technical support
CONFIDENTIALITY
Built for Confidential Engineering
Semiconductor engineering involves sensitive IP, design information and product roadmaps. We understand the importance of confidentiality and controlled access.
- NDA-based engagements
- Controlled access to project information
- Confidentiality practices across the team
- Secure engineering workflows
CAREERS
Build your career in silicon.
Explore opportunities with Terasilicon IQ across formal verification, timing closure, power integrity, physical design and signoff-focused engineering.
Engineering Capability Map
WHAT WE SUPPORT
End-to-end semiconductor engineering support across design, verification, timing, power integrity, physical implementation and sign-off.
01
ASIC / SoC Support
End-to-end semiconductor engineering support across complex ASIC and SoC development programs.
Subsystem & SoC verification
Block, subsystem and full-SoC verification support.
Architecture-aware engineering
Verification aligned with system architecture and requirements.
Interface verification
AMBA, custom and high-speed interface verification.
Integration support
IP and subsystem integration with verification and debug support.
IP & reusable component verification
Verification of IPs and reusable components for robust integration.
Sign-off & production readiness
Sign-off quality, compliance and release readiness support.
02
RTL Design & DFT Support
Implementation-aware RTL and DFT support for robust, reusable digital logic.
SystemVerilog RTL
Structured RTL development for reusable digital blocks.
Control & data-path logic
FSM, control and datapath implementation support.
DFT-aware design support
Design considerations aligned with test and verification needs.
Design quality support
Verification-aware coding, review and debug support.
RTL quality & lint readiness
Coding-quality checks and verification-aware RTL review.
DFT / test integration
Design-for-test considerations and integration support.
03
Design Verification Support
Simulation-based verification focused on functional correctness, coverage and regression quality.
SystemVerilog
Assertion and testbench-driven verification.
UVM methodology
Reusable, scalable verification environments.
Assertions
Concurrent assertions for protocol and functional intent.
Functional coverage
Coverage-driven planning and closure.
Coverage closure
Coverage gap analysis and targeted closure planning.
Regression & debug
Failure triage, regression analysis and debug support.
04
Formal Verification / FPV Support
Property-driven verification for critical RTL, control logic and hard-to-reach corner cases.
Safety & protocol properties
Formalized functional and protocol intent.
SVA property development
Precise temporal properties for RTL behavior.
Bug hunting & counterexamples
Expose and debug corner-case failures.
Proof & coverage analysis
Proof convergence and formal coverage closure.
Assumptions & constraints
Formal environment modeling and constraint refinement.
COI & convergence analysis
Cone-of-influence analysis and proof convergence support.
05
STA & Timing Closure Support
Timing analysis and closure support for implementation and sign-off readiness.
Static timing analysis
Timing-path analysis across design constraints.
Constraint validation
Review and refinement of timing constraints.
Setup / hold closure
Identify and address timing violations.
Sign-off readiness
Evidence-driven timing closure support.
Clock-domain timing
Clock-path and domain-aware timing analysis.
Path exception analysis
Review of false paths, multicycle paths and exceptions.
06
EMIR & Power Integrity Support
Power integrity analysis supporting reliable physical implementation and sign-off.
EM / IR analysis
Electromigration and IR-drop analysis support.
Power integrity
Identify power-network integrity risks.
Hotspot investigation
Debug and root-cause analysis of violations.
Sign-off support
Closure evidence for power integrity readiness.
Power-network analysis
Power-grid behavior analysis across critical operating conditions.
Closure & sign-off evidence
Violation closure and power-integrity readiness support.
07
Physical Design & Signoff Support
Physical implementation support focused on PPA, timing and sign-off quality.
Floorplan & implementation
Implementation-aware physical design support.
PPA optimization
Power, performance and area trade-off analysis.
Physical closure
Resolve implementation and sign-off issues.
Design sign-off
Structured readiness support for tapeout.
Routing & optimization
Implementation optimization for timing, congestion and PPA.
Tapeout readiness
Final physical closure and structured sign-off preparation.
08
Physical Verification Support
Physical verification support for final layout quality and production readiness.
DRC / LVS support
Physical rule and layout-versus-schematic verification.
Sign-off checks
Final physical verification analysis.
Violation debug
Root-cause analysis and closure support.
Production readiness
Evidence-driven physical sign-off support.
DRC / LVS closure
Violation triage, debug and physical sign-off closure.
Final layout readiness
Production-oriented physical verification and release support.
Use the arrows or select a capability to explore the engineering support areas.
FREQUENTLY ASKED
Before you reach out
Common questions from engineering and program leads evaluating an outside semiconductor engineering partner.
Anywhere from a single block-level closure problem to a dedicated, longer-term extension of your internal team. Scope is defined upfront against a specific technical requirement, not a fixed package.
Every engagement is covered by an NDA before any design data changes hands. Access is scoped to what the engagement requires, and data handling practices are agreed with your team before work begins.
Yes. Engagements can align with your existing verification, implementation and sign-off flow, including the tools, environments and reporting practices already used by your engineering team.
Progress can be reported through agreed milestones, verification evidence, issue and closure status, technical reviews and concise engineering updates tailored to your program.
Our engineering team is based in India, with collaboration structured around the working hours and overlap windows needed by each client program.
GET IN TOUCH
Have an ASIC/SoC
Engineering Requirement?
Tell us about your project, signoff challenge or engineering capacity requirement.
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